Cime -Découpe

Technical means - Hybrid workshop platform

The workshop offers research a wide range of tools in microelectronics :
 
  • ​Screen printing machine
  • Disco Cutting Machine
  • FlipChip Machine
  • Aluinium wire micro welder
  • Ball-bonding machine....


Screen printing machine - ATMA AT-25 PAB




either pastes or inks in thick layers
 


FLIP CHIP machine - Microtechnic JPF PP6


Bonding of the flipped chip for an electrical connection either by THERMOCOMPRESSION or THERMOSONIC


 


Machine for making aluminum micro-welds - WEDGE


with wire is 18µm / 25µm / 33µm / 50µm / 75µm


Machine for making gold bumps - Microtest



with a 25µm wire


Oven - Thermolymer 48000


Heat treatment at 850 ° C to solidify the surface


Hotplate - BIOBLOCK Scientific




(Drying at 125 ° C) to remove the solvent


Diamond Saw Machine




Cutting of different materials: silicon, glass, quartz, lithium niobate, aluminum, etc.